China Construction Bank (Asia) Selects FinIQ for Structured Products Distribution and Processing

Feb 25th, 2010, Hong Kong

China Construction Bank (Asia), Hong Kong selects FinIQ for Structured Products Distribution and Processing. The system will integrate into bank's existing infrastructure and will automate the entire life cycle for equity linked structures, starting from product publishing, order aggregation, customer correspondence, post trade event management all the way to redemptions and maturities.

Hong Kong - China Construction Bank (Asia) ["CCB (Asia)" and FinIQ are pleased to announce an agreement to deploy the FinIQ System for managing the Structured Products business for the bank and its subsidiary, China Construction Bank (Asia) Finance ["CCB (Asia) Finance"]. The modules CCB (Asia) is initially deploying are focused around Equity-based structures. As the business expands, other structures will also be supported.

"CCB (Asia) is empowering its branches to trade structured products within the retail customer base and this would not have been practical without the FinIQ System," CCB (Asia) Senior Vice President & Chief Information Officer Michael Leung said. "Appealing to us the most is the uniqueness and retail-friendliness of FinIQ that helps manage the complexity of structured products and handle all post trade events."

CCB (Asia) is very focused on its’ customers and has chosen FinIQ to grow its structured products business whilst ensuring it can support customer needs. Leung continued "With ever-changing product structures and our scaling up of structured products distribution, it is important that we protect our customer interests. This can only be done if all the correct checks, events, triggers and controls are automated, and we believe this is when FinIQ comes into place and handles all for us. Going forward, our branches and our operations department will be provided with real-time information of pricing terms and the status of post trade events thus minimizing errors and increasing productivity."